Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107881 | Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layer | Huang-Hsien Chang, Min-Lung Huang, Yu-Cheng Chen, Syu-Tang Liu | 2021-08-31 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107881 | Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layer | Huang-Hsien Chang, Min-Lung Huang, Yu-Cheng Chen, Syu-Tang Liu | 2021-08-31 |