Issued Patents 2021
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211299 | Wiring structure having at least one sub-unit | — | 2021-12-28 |
| 11211325 | Semiconductor device package and method for manufacturing the same | Yan Wen CHUNG, Min-Lung Huang | 2021-12-28 |
| 11211316 | Wiring structure and method for manufacturing the same | — | 2021-12-28 |
| 11139232 | Wiring structure and method for manufacturing the same | — | 2021-10-05 |
| 11127697 | Semiconductor device and method of manufacturing the same | Yan Wen CHUNG, Wei Chu SUN | 2021-09-21 |
| 11101203 | Wiring structure comprising intermediate layer including a plurality of sub-layers | — | 2021-08-24 |
| 11075188 | Package structure and assembly structure | — | 2021-07-27 |
| 11069605 | Wiring structure having low and high density stacked structures | — | 2021-07-20 |
| 11062985 | Wiring structure having an intermediate layer between an upper conductive structure and conductive structure | — | 2021-07-13 |
| 11031382 | Passive element, electronic device and method for manufacturing the same | Pei-Jen Lo, Chien-Han Chiu | 2021-06-08 |
| 11031326 | Wiring structure, electronic device and method for manufacturing the same | Chien-Mei Huang, Yan Wen CHUNG | 2021-06-08 |
| 11018120 | Semiconductor device package with stress buffering layer and method for manufacturing the same | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Yuh-Shan Su, Chih-Cheng Lee +1 more | 2021-05-25 |
| 10978417 | Wiring structure and method for manufacturing the same | — | 2021-04-13 |
| 10939561 | Wiring structure and method of manufacturing the same | Min-Lung Huang | 2021-03-02 |
| 10903169 | Conductive structure and wiring structure including the same | — | 2021-01-26 |
| 10892213 | Wiring structure and method for manufacturing the same | Li-Yu Hsieh, Yan Wen CHUNG | 2021-01-12 |