Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031326 | Wiring structure, electronic device and method for manufacturing the same | Wen-Hung Huang, Yan Wen CHUNG | 2021-06-08 |
| 11018120 | Semiconductor device package with stress buffering layer and method for manufacturing the same | Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Yuh-Shan Su, Chih-Cheng Lee +1 more | 2021-05-25 |