Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11018120 | Semiconductor device package with stress buffering layer and method for manufacturing the same | Chien-Mei Huang, Shih-Yu Wang, Wen-Hung Huang, Yuh-Shan Su, Chih-Cheng Lee +1 more | 2021-05-25 | $3,251,000 |