Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205628 | Semiconductor device package and method of manufacturing the same | Yu-Lin Shih | 2021-12-21 |
| 11201386 | Semiconductor device package and method for manufacturing the same | Cheng-Lin Ho, Chun-Chen Chen, Yuanhao Yu | 2021-12-14 |
| 11101186 | Substrate structure having pad portions | Cheng-Lin Ho | 2021-08-24 |
| 11088061 | Substrate, semiconductor device package and method of manufacturing the same | Cheng-Lin Ho | 2021-08-10 |
| 11062996 | Embedded component package structure and manufacturing method thereof | Hsing Kuo Tien | 2021-07-13 |
| 11056435 | Semiconductor package with chamfered pads | Cheng-Lin Ho, Chung-Chieh Chang, Ya Fang Chan | 2021-07-06 |
| 11031274 | Semiconductor device packages and method for manufacturing the same | Yu-Lin Shih | 2021-06-08 |
| 11024555 | Semiconductor substrate, semiconductor package, and method for forming the same | Cheng-Lin Ho | 2021-06-01 |
| 11018120 | Semiconductor device package with stress buffering layer and method for manufacturing the same | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Yuh-Shan Su +1 more | 2021-05-25 |
| 11004779 | Semiconductor device package and a method of manufacturing the same | Po-Shu Peng, Cheng-Lin Ho | 2021-05-11 |
| 10886208 | Semiconductor device package, electronic assembly and method for manufacturing the same | Cheng-Lin Ho, Chun-Chen Chen, Chen Chen | 2021-01-05 |