Chih-Cheng Lee — 11 Patents at Advanced Semiconductor Engineering

Issued Patents 2021

Showing 1–11 of 11 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11205628	Semiconductor device package and method of manufacturing the same	Yu-Lin Shih	2021-12-21	$2,997,000
11201386	Semiconductor device package and method for manufacturing the same	Cheng-Lin Ho, Chun-Chen Chen, Yuanhao Yu	2021-12-14	$2,223,000
11101186	Substrate structure having pad portions	Cheng-Lin Ho	2021-08-24	$2,094,000
11088061	Substrate, semiconductor device package and method of manufacturing the same	Cheng-Lin Ho	2021-08-10	$2,631,000
11062996	Embedded component package structure and manufacturing method thereof	Hsing Kuo Tien	2021-07-13	$2,568,000
11056435	Semiconductor package with chamfered pads	Cheng-Lin Ho, Chung-Chieh Chang, Ya Fang Chan	2021-07-06	$4,775,000
11031274	Semiconductor device packages and method for manufacturing the same	Yu-Lin Shih	2021-06-08	$2,156,000
11024555	Semiconductor substrate, semiconductor package, and method for forming the same	Cheng-Lin Ho	2021-06-01	$2,470,000
11018120	Semiconductor device package with stress buffering layer and method for manufacturing the same	Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Yuh-Shan Su +1 more	2021-05-25	$3,251,000
11004779	Semiconductor device package and a method of manufacturing the same	Po-Shu Peng, Cheng-Lin Ho	2021-05-11	$8,752,000
10886208	Semiconductor device package, electronic assembly and method for manufacturing the same	Cheng-Lin Ho, Chun-Chen Chen, Chen Chen	2021-01-05	$1,548,000