Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056435 | Semiconductor package with chamfered pads | Cheng-Lin Ho, Chung-Chieh Chang, Chih-Cheng Lee | 2021-07-06 |
| 11037853 | Semiconductor package structure and method of manufacturing the same | Yuan-Feng Chiang, Po-Wei LU | 2021-06-15 |