Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201386 | Semiconductor device package and method for manufacturing the same | Chih-Cheng Lee, Chun-Chen Chen, Yuanhao Yu | 2021-12-14 |
| 11101186 | Substrate structure having pad portions | Chih-Cheng Lee | 2021-08-24 |
| 11088061 | Substrate, semiconductor device package and method of manufacturing the same | Chih-Cheng Lee | 2021-08-10 |
| 11056435 | Semiconductor package with chamfered pads | Chung-Chieh Chang, Ya Fang Chan, Chih-Cheng Lee | 2021-07-06 |
| 11024555 | Semiconductor substrate, semiconductor package, and method for forming the same | Chih-Cheng Lee | 2021-06-01 |
| 11004779 | Semiconductor device package and a method of manufacturing the same | Po-Shu Peng, Chih-Cheng Lee | 2021-05-11 |
| 10937400 | Cable-driven beater mechanism for percussion instrument | Pei-Chi Chu, Wei-Ting Chen, Chi-Chia Huang | 2021-03-02 |
| 10886208 | Semiconductor device package, electronic assembly and method for manufacturing the same | Chih-Cheng Lee, Chun-Chen Chen, Chen Chen | 2021-01-05 |