Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10886208 | Semiconductor device package, electronic assembly and method for manufacturing the same | Cheng-Lin Ho, Chih-Cheng Lee, Chun-Chen Chen | 2021-01-05 | $1,548,000 |