Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189576 | Semiconductor device package and a method of manufacturing the same | Peng Yang, Yuan-Feng Chiang | 2021-11-30 |
| 11037853 | Semiconductor package structure and method of manufacturing the same | Ya Fang Chan, Yuan-Feng Chiang | 2021-06-15 |