Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11189576 | Semiconductor device package and a method of manufacturing the same | Peng Yang, Yuan-Feng Chiang | 2021-11-30 | $1,888,000 |
| 11037853 | Semiconductor package structure and method of manufacturing the same | Ya Fang Chan, Yuan-Feng Chiang | 2021-06-15 | $2,096,000 |