Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device packages and method for manufacturing the same

Semiconductor device packages and method for manufacturing the same

US Patent 11031274 · Granted Jun 8, 2021

Estimated economic value: $2,156,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Driving assembly and transfer device2025
Liquid-cooling system including monitoring and alerting module, monitoring and a2025
Electronic package2025
Electronic package2025
Package substrate, electronic device package and method for manufacturing the sa2025
Lifting assembly having gear structure and lifting device having the same2025
Semiconductor device package including stress buffering layer2025
Semiconductor device package and method of manufacturing the same2025
Structure for holding battery permitting rapid replacement and automated guided 2024
Energy absorbing structure for vehicle-mounted display screen and display screen2024
Substrate, semiconductor device package and method of manufacturing the same2024
Robot using limiting device for locking battery2024