Issued Patents 2021
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189587 | Semiconductor device package with organic reinforcement structure | — | 2021-11-30 |
| 11177552 | Semiconductor device package and method for manufacturing the same | — | 2021-11-16 |
| 11158572 | Package structure including a first electronic device, a second electronic device and a plurality of dummy pillars | — | 2021-10-26 |
| 11139247 | Interconnection structure, semiconductor package and method of manufacturing the same | — | 2021-10-05 |
| 11101541 | Semiconductor assembly and method for manufacturing the same | — | 2021-08-24 |
| 11088101 | Semiconductor package structure and method of manufacturing the same | — | 2021-08-10 |
| 11062994 | Semiconductor device package and method of manufacturing the same | — | 2021-07-13 |
| 11063015 | Semiconductor device package and method of manufacturing the same | — | 2021-07-13 |
| 11056446 | Semiconductor package device and semiconductor process | — | 2021-07-06 |
| 11031361 | Semiconductor bonding structure and method of manufacturing the same | — | 2021-06-08 |
| 11024569 | Semiconductor package device and method of manufacturing the same | Jen-Kuang Fang | 2021-06-01 |
| 10998251 | Semiconductor package structure and a method of manufacturing the same | — | 2021-05-04 |
| 10964616 | Semiconductor package structure and method of manufacturing the same | — | 2021-03-30 |
| 10903151 | Semiconductor device package and method of manufacturing the same | — | 2021-01-26 |
| 10886149 | Semiconductor device package and method of manufacturing the same | — | 2021-01-05 |
| 10886233 | Semiconductor device package and method of manufacturing the same | — | 2021-01-05 |