Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201125 | Semiconductor package and semiconductor process | Sheng-Chi Hsieh, Hung-Yi Lin, Pao-Nan Lee, Chien-Hua Chen | 2021-12-14 |
| 11189604 | Device assembly structure and method of manufacturing the same | Chao-Kai Hung, Chien-Wei Chang, Ya-Chen Shih, Hung-Jung Tu, Hung-Yi Lin | 2021-11-30 |
| 11037846 | Semiconductor package structure and method of manufacturing the same | Chien-Hua Chen, Hsu-Chiang Shih, Hung-Yi Lin | 2021-06-15 |
| 10903907 | System comprising packaged optical devices | Chang-Yu Lin, Hung-Yi Lin | 2021-01-26 |