Issued Patents 2021
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201125 | Semiconductor package and semiconductor process | Sheng-Chi Hsieh, Hung-Yi Lin, Cheng-Yuan KUNG, Pao-Nan Lee | 2021-12-14 |
| 11186090 | Fluid ejection device | Michael W. Cumbie, Erik D. Torniainen | 2021-11-30 |
| 11186082 | Conductive elements electrically coupled to fluidic dies | Michael W. Cumbie | 2021-11-30 |
| 11183437 | Circuit package | Michael W. Cumbie, Stephen Farrar | 2021-11-23 |
| 11155086 | Fluidic ejection devices with enclosed cross-channels | Si-Iam J. Choy, Michael W. Cumbie, Jeffrey R. Pollard | 2021-10-26 |
| 11148942 | Three-dimensional features formed in molded panel | Devin Alexander Mourey, Michael G. Groh | 2021-10-19 |
| 11135839 | Die contact formations | Michael W. Cumbie, Anthony M. Fuller, Zhen Yi Li | 2021-10-05 |
| 11130339 | Molded fluid flow structure | Michael W. Cumbie, Silam J. Choy | 2021-09-28 |
| 11110714 | Preloaded storage container and print head to dispense fluid | Jeffrey A. Nielsen, Michael W. Cumbie | 2021-09-07 |
| 11097537 | Fluid ejection die molded into molded body | Michael W. Cumbie, Anthony M. Fuller | 2021-08-24 |
| 11090929 | Complex impedance detection | Michael W. Cumbie, Devin Alexander Mourey | 2021-08-17 |
| 11065883 | Cross-die recirculation channels and chamber recirculation channels | Jeffrey R. Pollard, Michael W. Cumbie, Si-lam Choy | 2021-07-20 |
| 11059291 | Fluidic ejection dies with enclosed cross-channels | Si-lam Choy, Michael W. Cumbie, Jeffrey R. Pollard | 2021-07-13 |
| 11046073 | Fluid ejection die heat exchangers | Michael W. Cumbie, James R. Przybyla | 2021-06-29 |
| 11046084 | Liquid level sensing | Michael W. Cumbie, Devin Alexander Mourey, Anthony D. Studer | 2021-06-29 |
| 11037846 | Semiconductor package structure and method of manufacturing the same | Hsu-Chiang Shih, Cheng-Yuan KUNG, Hung-Yi Lin | 2021-06-15 |
| 11020967 | Printhead | Michael W. Cumbie | 2021-06-01 |
| 11007712 | Three-dimensional (3D) printing with epoxy resin | Qin Liu, Michael G. Monroe, Bruce Cowger | 2021-05-18 |
| 11009383 | Fluid property sensing with electrodes | Michael W. Cumbie, Greg Scott Long | 2021-05-18 |
| 11009382 | Liquid level sensing | Michael W. Cumbie, Robert N. K. Browning | 2021-05-18 |
| 10994539 | Fluid flow structure forming method | Michael W. Cumbie | 2021-05-04 |
| 10994541 | Molded fluid flow structure with saw cut channel | Michael W. Cumbie, Arun Agarwal | 2021-05-04 |
| 10964652 | Semiconductor device package and method of manufacturing the same | Sheng-Chi Hsieh | 2021-03-30 |
| 10946658 | Encapsulating a bonded wire with low profile encapsulation | Michael W. Cumbie, Zhuqing Zhang | 2021-03-16 |
| 10946648 | Fluid ejection die fluid recirculation | Michael W. Cumbie, Si-lam Choy | 2021-03-16 |