Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11135839 | Die contact formations | Michael W. Cumbie, Chien-Hua Chen, Zhen Yi Li | 2021-10-05 |
| 11097537 | Fluid ejection die molded into molded body | Chien-Hua Chen, Michael W. Cumbie | 2021-08-24 |
| 10933634 | Conductive wire disposed in a layer | Terry McMahon, Donald W. Schulte, Amy Gault | 2021-03-02 |
| 10927472 | Method of forming a micro-structure | Peter Mardilovich, Qingqiao Wei | 2021-02-23 |