Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127650 | Semiconductor device package including thermal dissipation element and method of manufacturing the same | Chien Lin CHANG CHIEN, Chiu-Wen LEE, Hung-Jung Tu, Chin-Li KAO | 2021-09-21 |