Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211283 | Method for forming a bulk semiconductor substrate configured to exhibit soi behavior | Kun-Tsang Chuang, Hsin-Chi Chen | 2021-12-28 |
| 11183570 | Structures and methods for noise isolation in semiconductor devices | Tsung-Han Tsai, Kun-Tsang Chuang | 2021-11-23 |
| 11145539 | Shallow trench isolation for integrated circuits | Hsin-Chi Chen, Kun-Tsang Chuang | 2021-10-12 |
| 11101354 | Method for forming semiconductor device structure with metal silicide layer | Cheng-Yeh Huang, Chin-Nan Chang, Chih-Ming Lee, Chi-Yen Lin | 2021-08-24 |
| 10886165 | Method of forming negatively sloped isolation structures | Tsung-Han Tsai, Kun-Tsang Chuang | 2021-01-05 |