Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152417 | Anchor structures and methods for uniform wafer planarization and bonding | Chia-Yu Wei, Hsin-Chi Chen, Kuo-Cheng Lee, Hsun-Ying Huang, Yen-Liang Lin | 2021-10-19 |
CL
Cheng-Yuan Li
Overall (2021): #498,809 of 548,734Top 95%
1
Patents 2021