GB

Griselda Bonilla

IBM: 2 patents #3,096 of 11,638Top 30%
Overall (2021): #159,900 of 548,734Top 30%
2
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
10964647 Dielectric crack stop for advanced interconnects Baozhen Li, Chih-Chao Yang 2021-03-30
10957657 Advanced crack stop structure Chih-Chao Yang, Baozhen Li, Xiao Hu Liu 2021-03-23