Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189596 | Methods of forming multi-chip wafer level packages | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng | 2021-11-30 |
| 11056445 | Package structure with buffer layer sandwiched between encapsulation layer and semiconductor substrate | Hsien-Wen Liu, Shin-Puu Jeng | 2021-07-06 |
| 11050868 | Internet phone system | Yu-Ti Kuo, Wen-Hsieh Hsieh, Chao-Tang Chiu, Chien-Yi Lee, Ching-Jen Wang | 2021-06-29 |
| 10890837 | Structured light projection system | I-Hsin Tung | 2021-01-12 |