Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011447 | Semiconductor package and method for forming the same | Chin-Hua Wang, Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin | 2021-05-18 |
SY
Shu-Shen Yeh
Overall (2021): #258,585 of 548,734Top 50%
1
Patents 2021