Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011447 | Semiconductor package and method for forming the same | Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh | 2021-05-18 |
CW
Chin-Hua Wang
Overall (2021): #493,842 of 548,734Top 90%
1
Patents 2021