Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133274 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2021-09-28 |
| 11101192 | Wafer level embedded heat spreader | Wei Sen Chang, Tsung-Hsien Chiang, Ching-Wen Hsiao | 2021-08-24 |