Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101192 | Wafer level embedded heat spreader | Tsung-Hsien Chiang, Yen-Chang Hu, Ching-Wen Hsiao | 2021-08-24 |
| 10978362 | Semiconductor structure with conductive structure | Pei-Chun Tsai, Tin-Hao Kuo, Hao-Yi Tsai | 2021-04-13 |
| 10978363 | Semiconductor structure with conductive structure | Pei-Chun Tsai, Tin-Hao Kuo, Hao-Yi Tsai | 2021-04-13 |