Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088080 | Chip package structure using silicon interposer as interconnection bridge | Hung-Hsin Hsu, Shang-Yu Chang Chien, Nan-Chun Lin | 2021-08-10 |
| 10978362 | Semiconductor structure with conductive structure | Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai | 2021-04-13 |
| 10978363 | Semiconductor structure with conductive structure | Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai | 2021-04-13 |