Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211350 | Semiconductor package and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2021-12-28 |
| 11211321 | Package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2021-12-28 |
| 11171106 | Semiconductor package structure with circuit substrate and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2021-11-09 |
| 11127699 | Chip package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2021-09-21 |
| 11094654 | Package structure and method of manufacturing the same | Nan-Chun Lin, Hung-Hsin Hsu | 2021-08-17 |
| 11088100 | Semiconductor package and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2021-08-10 |
| 11088080 | Chip package structure using silicon interposer as interconnection bridge | Pei-Chun Tsai, Hung-Hsin Hsu, Nan-Chun Lin | 2021-08-10 |
| 10978408 | Semiconductor package and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2021-04-13 |
| 10950593 | Package structure including at least one connecting module and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2021-03-16 |