Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043462 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2021-06-22 |
YT
Yu-Jen Tseng
Overall (2021): #192,361 of 548,734Top 40%
1
Patents 2021