Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018099 | Semiconductor structure having a conductive bump with a plurality of bump segments | Pei-Haw Tsao, Huang-Ting Hsiao, Kuo-Chin Chang | 2021-05-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018099 | Semiconductor structure having a conductive bump with a plurality of bump segments | Pei-Haw Tsao, Huang-Ting Hsiao, Kuo-Chin Chang | 2021-05-25 |