Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177228 | Semiconductor device and bump formation process | Sheng-Yu Wu, Ching-Hui Chen, Mirng-Ji Lii, Kai-Di Wu, Chien-Hung Kuo +3 more | 2021-11-16 |
| 11171085 | Semiconductor device structure with magnetic layer and method for forming the same | Wei-Li Huang, Chun-Kai Tzeng, Cheng-Jen Lin, Chin-Yu Ku | 2021-11-09 |
| 11127703 | Semiconductor devices | Chin-Yu Ku, Cheng-Lung Yang, Chen-Shien Chen, Chao-Yi Wang, Ching-Hui Chen +1 more | 2021-09-21 |
| 11094776 | Structure and formation method of semiconductor device with magnetic element covered by polymer material | Chi-Cheng Chen, Wei-Li Huang, Chun-Yi Wu, Kuang-Yi Wu, Chih-Hung Su +2 more | 2021-08-17 |
| 11081459 | Semiconductor device | Chin-Yu Ku, Chao-Yi Wang, Chen-Shien Chen, Chien-Hung Kuo | 2021-08-03 |