Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164839 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu +1 more | 2021-11-02 |
| 11121006 | Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package | Hung-Jui Kuo, Yu-Hsiang Hu | 2021-09-14 |
| 11101176 | Method of fabricating redistribution circuit structure | Yu-Hsiang Hu, Hung-Jui Kuo | 2021-08-24 |
| 10998202 | Semiconductor package and manufacturing method thereof | Hung-Jui Kuo, Yu-Hsiang Hu | 2021-05-04 |
| 10964650 | Info structure and method forming same | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2021-03-30 |