Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201079 | Wafer chuck | Chen-Hua Yu, Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen | 2021-12-14 |
| 11164839 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Po-Han Wang, Yung-Chi Chu +1 more | 2021-11-02 |
| 11114407 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Yung-Chi Chu | 2021-09-07 |
| 11049812 | Semiconductor devices and methods of forming the same | Hung-Jui Kuo, Yu-Hsiang Hu, Meng-Che Tu | 2021-06-29 |
| 11031289 | Semiconductor package and methods of forming the same | Meng-Che Tu, Wei-Chih Chen, Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2021-06-08 |
| 11004796 | Integrated fan-out package | Meng-Che Tu, Hung-Jui Kuo, Yu-Hsiang Hu | 2021-05-11 |
| 10978405 | Integrated fan-out package | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu | 2021-04-13 |