Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164814 | Package structure and method of manufacturing the same | Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen | 2021-11-02 |
| 11164839 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Po-Han Wang +1 more | 2021-11-02 |
| 11114407 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2021-09-07 |