Issued Patents 2021
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037877 | Package structure and method of manufacturing the same | Zi-Jheng Liu, Ming-Tan Lee | 2021-06-15 |
| 11031289 | Semiconductor package and methods of forming the same | Meng-Che Tu, Wei-Chih Chen, Sih-Hao Liao, Yu-Hsiang Hu, Chen-Hua Yu | 2021-06-08 |
| 11031351 | Method of manufacturing a semiconductor device | Zi-Jheng Liu, Jo-Lin Lan, Yu-Hsiang Hu | 2021-06-08 |
| 11031342 | Semiconductor package and method | Shih-Hao Tseng, Ming-Che Ho | 2021-06-08 |
| 11024581 | Semiconductor packages and methods of manufacturing the same | Yi-Wen Wu, Ming-Che Ho | 2021-06-01 |
| 11018083 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Ching-Feng Yang, Kai-Chiang Wu, Ming-Che Ho | 2021-05-25 |
| 11004812 | Package structure and method of forming the same | Tuan-Yu Hung, Hsin-Yu Pan, Ming-Che Ho, Tzu-Yun Huang, Yen-Fu Su | 2021-05-11 |
| 11004796 | Integrated fan-out package | Meng-Che Tu, Yu-Hsiang Hu, Sih-Hao Liao | 2021-05-11 |
| 10998202 | Semiconductor package and manufacturing method thereof | Po-Han Wang, Yu-Hsiang Hu | 2021-05-04 |
| 10985116 | Semiconductor package and method of forming the same | Ching-Wen Chen, Ming-Che Ho | 2021-04-20 |
| 10978405 | Integrated fan-out package | Jhih-Yu Wang, Yu-Hsiang Hu, Sih-Hao Liao | 2021-04-13 |
| 10978412 | Manufacturing method of package structure | Hui-Jung Tsai, Tsao-Lun Chang, Tai-Min Chang | 2021-04-13 |
| 10971442 | Semiconductor device having via sidewall adhesion with encapsulant | Chen-Hua Yu, Yun Chen Hsieh, Hui-Jung Tsai | 2021-04-06 |
| 10964591 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hui-Jung Tsai, Chen-Hua Yu | 2021-03-30 |
| 10964650 | Info structure and method forming same | Po-Han Wang, Yu-Hsiang Hu, Chen-Hua Yu | 2021-03-30 |
| 10957645 | Package structure having conductive patterns with crystal grains copper columnar shape and method manufacturing the same | Yu-Ming Lee, Chiang-Hao Lee, Ming-Che Ho | 2021-03-23 |
| 10937688 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Chen-Cheng Kuo | 2021-03-02 |
| 10930586 | Integrated fan-out package and method of fabricating the same | Yi-Wen Wu, Ming-Che Ho | 2021-02-23 |
| 10892228 | Method of manufacturing conductive feature and method of manufacturing package | Hui-Jung Tsai, Yun Chen Hsieh | 2021-01-12 |
| 10886231 | Method of forming RDLS and structure formed thereof | Yun Chen Hsieh, Hui-Jung Tsai, Chen-Hua Yu | 2021-01-05 |