Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121093 | Methods for selectively forming identification mark on semiconductor wafer | Yue-Lin Peng, Cheng-Yi Huang, Shou-Wen Kuo | 2021-09-14 |
| 11088109 | Packages with multi-thermal interface materials and methods of fabricating the same | Chih-Hao Lin, Chien-Kuo Chang, Pu-Sheng Lee, Hsien-Liang Meng | 2021-08-10 |