Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088037 | Semiconductor device having probe pads and seal ring | Yang-Che Chen, Wei-Yu Chou, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang +1 more | 2021-08-10 |
| 11075173 | Semiconductor device and method of forming same | Chih-Hsiang Tseng, Yu-Feng Chen, Cheng-Jen Lin, Wen-Hsiung Lu, Ming-Da Cheng +4 more | 2021-07-27 |
| 11011462 | Method for forming fuse pad and bond pad of integrated circuit | Tai-I Yang, Chun-Yi Yang, Chih-Hao Lin, Ruei-Hung Jang | 2021-05-18 |