Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088037 | Semiconductor device having probe pads and seal ring | Wei-Yu Chou, Hong-Seng Shue, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang +1 more | 2021-08-10 |
| 10937772 | Semiconductor package and method for manufacturing the same | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2021-03-02 |
| 10937858 | Method for manufacturing semiconductor and structure thereof | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2021-03-02 |