Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011462 | Method for forming fuse pad and bond pad of integrated circuit | Tai-I Yang, Chun-Yi Yang, Chih-Hao Lin, Hong-Seng Shue | 2021-05-18 |
RJ
Ruei-Hung Jang
Overall (2021): #279,792 of 548,734Top 55%
1
Patents 2021