Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139282 | Semiconductor package structure and method for manufacturing the same | Kuo-Chiang Ting, Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen, Wan-Yu Lee +1 more | 2021-10-05 |