Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088086 | Chip package structure and method for forming the same | Ying-Ching Shih, Szu-Wei Lu, Chih-Wei Wu | 2021-08-10 |
JC
Jiun-Ting Chen
Overall (2021): #406,815 of 548,734Top 75%
1
Patents 2021