Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164855 | Package structure with a heat dissipating element and method of manufacturing the same | Weiming Chris Chen, Chi-Hsi Wu, Chih-Wei Wu, Kuo-Chiang Ting, Szu-Wei Lu +3 more | 2021-11-02 |
| 11152330 | Semiconductor package structure and method for forming the same | Pu Wang, Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2021-10-19 |