Issued Patents 2021
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056364 | Method for substrate thinning | Yi-Chao Mao, Chin-Chuan Chang | 2021-07-06 |
| 11056436 | Integrated fan-out structure with rugged interconnect | Shih-Ting Lin, Jing-Cheng Lin, Chen-Hua Yu | 2021-07-06 |
| 11031381 | Optical transceiver and manufacturing method thereof | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng | 2021-06-08 |
| 11024616 | Package structure and method of manufacturing the same | Yu-Wei Chen, Li-Chung Kuo, Long Hua Lee, Ying-Ching Shih, Kuan-Yu Huang | 2021-06-01 |
| 10985140 | Structure and formation method of package structure with underfill | Chen-Hsuan Tsai, Tsung-Fu Tsai, Shih-Ting Lin | 2021-04-20 |
| 10964609 | Apparatus and method for detecting end point | Yi-Chao Mao, Chin-Chuan Chang | 2021-03-30 |
| 10957616 | Package structure and method | Jing-Cheng Lin, Chen-Hua Yu | 2021-03-23 |
| 10943873 | Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same | Jing-Cheng Lin, Chen-Hua Yu, Yen-Yao Chi | 2021-03-09 |
| 10923438 | Package structure and method for forming the same | Tsung-Fu Tsai, Kung-Chen Yeh, I-Ting Huang, Shih-Ting Lin | 2021-02-16 |
| 10916488 | Semiconductor package having thermal conductive pattern surrounding the semiconductor die | Jing-Cheng Lin | 2021-02-09 |
| 10916450 | Package of integrated circuits having a light-to-heat-conversion coating material | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Jing-Cheng Lin | 2021-02-09 |