Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205579 | Molding wafer chamber | Jing-Cheng Lin, Jui-Pin Hung, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu | 2021-12-21 |
| 11094635 | Package structure and method for forming the same | Szu-Wei Lu | 2021-08-17 |
| 11056364 | Method for substrate thinning | Yi-Chao Mao, Szu-Wei Lu | 2021-07-06 |
| 10964609 | Apparatus and method for detecting end point | Yi-Chao Mao, Szu-Wei Lu | 2021-03-30 |