Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069653 | Methods and structures for packaging semiconductor dies | Jing-Cheng Lin | 2021-07-20 |
| 11056364 | Method for substrate thinning | Chin-Chuan Chang, Szu-Wei Lu | 2021-07-06 |
| 10964609 | Apparatus and method for detecting end point | Chin-Chuan Chang, Szu-Wei Lu | 2021-03-30 |