Issued Patents 2021
Showing 26–26 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10939551 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Wei Chen, Li-Han Hsu +1 more | 2021-03-02 |