Issued Patents 2021
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069662 | Semiconductor package and manufacturing method thereof | Jie Chen | 2021-07-20 |
| 11063022 | Package and manufacturing method of reconstructed wafer | Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh, Tzuan-Horng Liu | 2021-07-13 |
| 11056464 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Jie Chen | 2021-07-06 |
| 11056433 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Der-Chyang Yeh, Chen-Hua Yu | 2021-07-06 |
| 11043410 | Packages with through-vias having tapered ends | — | 2021-06-22 |
| 11043463 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Ming-Da Cheng, Chung-Shi Liu | 2021-06-22 |
| 11043482 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Chi-Hwang Tai | 2021-06-22 |
| 11037887 | Method of making package assembly including stress relief structures | — | 2021-06-15 |
| 11037899 | Package structures and methods of forming the same | Li-Hsien Huang, An-Jhih Su | 2021-06-15 |
| 11031363 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | — | 2021-06-08 |
| 11031354 | Mixing organic materials into hybrid packages | Ming-Fa Chen, Chih-Chia Hu, Chen-Hua Yu | 2021-06-08 |
| 11031352 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu, Chien-Chia Chiu +1 more | 2021-06-08 |
| 11018069 | Underfill control structures and method | Ying-Ju Chen, An-Jhih Su, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2021-05-25 |
| 11018066 | Integrated circuit package and method of forming same | Ming-Fa Chen, Chen-Hua Yu | 2021-05-25 |
| 11018025 | Redistribution lines having stacking vias | Li-Hsien Huang | 2021-05-25 |
| 11018104 | Semiconductor structure and method for manufacturing the same | Ming-Fa Chen | 2021-05-25 |
| 11018091 | Eliminate sawing-induced peeling through forming trenches | Jie Chen | 2021-05-25 |
| 11018088 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2021-05-25 |
| 11018070 | Semiconductor die, manufacturing method thereof, and semiconductor package | Jie Chen, Ming-Fa Chen | 2021-05-25 |
| 11004838 | Packaged die and RDL with bonding structures therebetween | Jie Chen | 2021-05-11 |
| 10998293 | Method of fabricating semiconductor structure | Jie Chen, Ming-Fa Chen, Ching-Jung Yang | 2021-05-04 |
| 10998277 | Guard ring method for semiconductor devices | Chung-Ying Yang | 2021-05-04 |
| 10978410 | Semiconductor structure and manufacturing method thereof | Tzuan-Horng Liu, Ming-Fa Chen | 2021-04-13 |
| 10971443 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen | 2021-04-06 |
| 10964659 | Semiconductor device | Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2021-03-30 |