Issued Patents 2021
Showing 51–64 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957610 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Chao-Hsiang Yang, Ming-Fa Chen | 2021-03-23 |
| 10950575 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su +1 more | 2021-03-16 |
| 10950579 | Integrated circuit package and method of forming same | Ming-Fa Chen, Chen-Hua Yu | 2021-03-16 |
| 10950577 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2021-03-16 |
| 10950576 | Package structure | Tzuan-Horng Liu, Jiun-Heng Wang, Ming-Fa Chen | 2021-03-16 |
| 10943889 | Semiconductor device and method of manufacture | Ying-Ju Chen, An-Jhih Su, Jie Chen | 2021-03-09 |
| 10943798 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2021-03-09 |
| 10939551 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2021-03-02 |
| 10937743 | Mixing organic materials into hybrid packages | Ming-Fa Chen, Chih-Chia Hu, Chen-Hua Yu | 2021-03-02 |
| 10930633 | Buffer design for package integration | Jie Chen, Ming-Fa Chen, Chen-Hua Yu | 2021-02-23 |
| 10930580 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Ming-Fa Chen | 2021-02-23 |
| 10923421 | Package structure and method of manufacturing the same | Ying-Ju Chen, Ming-Fa Chen | 2021-02-16 |
| 10886245 | Semiconductor structure, 3DIC structure and method of fabricating the same | Jie Chen, Ming-Fa Chen, Sung-Feng Yeh | 2021-01-05 |
| 10886238 | Supporting InFO packages to reduce warpage | Jie Chen, Ying-Ju Chen | 2021-01-05 |