Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201182 | Embedded image sensor semiconductor packages and related methods | — | 2021-12-14 |
| 11004832 | System, structure, and method of manufacturing a semiconductor substrate stack | Hung-Pin Chang, Wen-Chih Chiou, Chen-Hua Yu | 2021-05-11 |
| 10910421 | Molded image sensor chip scale packages and related methods | — | 2021-02-02 |
| 10903255 | Image sensor flip chip package | — | 2021-01-26 |