Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004827 | Semiconductor package and manufacturing method of semiconductor package | Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Yu-Chia Lai +3 more | 2021-05-11 |
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Wei-Kang Hsieh
Overall (2021): #215,777 of 548,734Top 40%
1
Patents 2021