Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107747 | Semiconductor package with composite thermal interface material structure and method of forming the same | Tung-Liang Shao, Jen-Yu Wang, Chih-Hang Tung, Chen-Hua Yu | 2021-08-31 |