Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177365 | Semiconductor device with adhesion layer | Chun-Chih Lin, Yen-Yu Chen | 2021-11-16 |
| 11164957 | Semiconductor device with adhesion layer and method of making | Chun-Chih Lin, Yen-Yu Chen | 2021-11-02 |
| 11081341 | Apparatus for fabricating a semiconductor device with target sputtering and target sputtering method for fabricating the semiconductor device | Yen-Yu Chen, Yi-Ming Dai | 2021-08-03 |
| 10923416 | Interconnect structure with insulation layer and method of forming the same | Chung-Liang Cheng, Yen-Yu Chen | 2021-02-16 |
| 10916517 | Redistribution layer metallic structure and method | Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin | 2021-02-09 |