Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916517 | Redistribution layer metallic structure and method | Shih Wei Bih, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin | 2021-02-09 |
SY
Sheng-Wei Yeh
Overall (2021): #258,581 of 548,734Top 50%
1
Patents 2021